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Semiconductor industry is divided into Integrated Device Manufacturers, front-end process(design-fabless, foundry),
and back-end service(bump, test, assembly). TESNA is providing differentiated total solutions related with testing of
various semiconductor products. As the IT industry is rapidly growing, semiconductors are more widely used. As a leading company in semiconductor test industry, TESNA is expanding business areas and range of products in order to
grow into a semiconductor total solution company.

- Bumping technology maximizes electric flow while minimizing the size of wafer during back-end process
- Proceed with gold or solder bumping depending on materials

Probe Test
- Test whether IC on wafer electrically functions properly. Distinguish good and bad.
- Inform yield to design/manufacture companies, carry out a 1st step test whether there are problems in design
- and manufacture process

Back Grinding
- With IT technologies and products being more integrated, back grinding process makes a wafer thinner in order to produce
- multi-layered chips, high density packages.

- Packaging process(plastic, films, etc.)
hips, high density packages.
Final Test
- Distinguish good and bad before the final shipment after packaging process

Image Sensor
- An Essential component for camera phones, digital cameras, digital camcorders.
- A semiconductor sensor which converts light(optical image) into electrical signal.

Touch Sensor
- A touch sensor is used as input interface for display of OA products, etc. It detects a finger touching a screen and recognizes
- it as input. There are variable capacitance, variable resistance, and variable light sensor. Touch sensors are used in most smart
- devices.

- T-Con is IC which creates various control signals and data in order to show images and letters on display devices
- T-Con is used for LCD/LED/OLED TV, and 3D, Smart TV, etc.

SoC(System on Chip)
- SoC is a semiconductor that integrates all functions required by system such as logical calculation, data transfer,
- and memory in one chip.

- AP is used for mobile devices as CPU is used for computers

MCU(Micro Controller Unit)
- Unlike microprocessor, MCU is a processor containing a core, memory, and simple OS so that independent functions are possible.

Smart Card IC
- Smart card IC is a CPU intelligent card, which is made of plastic in credit card size and thickness.
- Microprocessor, memory, OS, and security algorithm are embedded in this card, so information can be stored and processed.