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Tester
Tester
Specification
iFlex 200MHz, 75V, Mixed Signal Option
Uflex 400Mbps, Mixed Signal Option, RF Option
T2000ISS Various MIPI Option, 64 Parallel, CIS Option
J750 200MHz, Mixed Signal Option
IP750EX 200MHz, CIS Option
Magnum ICP 100MHz, CIS Test option
Verigy93K 800Mbps, Mixed Signal Option
Magnum SV 100MHz, Mixed Signal Option
ST7200 200MHz, Mixed Signal Option
Magnum 1 ssv 200MHz, 512ch, Mixed Signal Option
Aemulus Upto 64 RF Port, 6GHz Frequency Range
ETS364 66MHz, APU-12, SPU-100
 
Others (Prober, Hander, AVI)
Equipment
 Specification
PROBER 8" ~ 12" Option, Hot & Cold Option
HANDLER Small PKG~ High Pin PKG : PDIP, PLCC, SOP, TSOP, QFP, LQFP, TQFP, GFN, BGA, CSP, TSV, etc. Test
AVI 8" ~ 12" Wafer AVI, 1.8㎛ Particle Inspection
Auto Bake 300mm Wafer Furnace system
UV Eraser U300mm Wafer, Auto Erase System
 
DP Equipment
Equipment Specification
Coater_DAVID-C300 Wafer Size : 8", 12" / Wafer coating thickness : ≤3um
Lamination_DT-ECS1030SA Wafer Size : 6", 8" / Cutter Heating : Up to 150℃
Lamination_CUWLA-120 Wafer Size : 8", 12" / Cutter Heating : Up to 120℃
Back Grind_DGP8760/61 Wafer Size : 8", 12" / Dry Polishing Option
Back Grind_DFG8540 Wafer Size : 4", 6", 8"
Back Grind_CMG802XJ Wafer Size : 8", 12" / Polishing Option
UV_CUUVA-120 Wafer Size : 8", 12" / Illuminance : 80~120mw/cm2
Laser Mark_CSM3300FC Wafer Size : 8", 12" / Wafer Length : Green 532nm
Plasma_JSPCS-700M Chamber Type / Gas control : Ar, O2, Ar+H2 2 Channel
Laser Groove_DFL-7161 Wafer Size : 8", 12" / Laser Type : FX Type
US Saw_CSX501 Wafer Size : 8" / Ultrasonic Spindle / Spindle RPM : 1,000~12,000
Dicing_DFD6361/62 Wafer Size : 8", 12" / Spindle RPM : 6,000～60,000/min, 20,000～80,000/min
Dicing_AD3000T Wafer Size : 8", 12" / Spindle RPM : 1,000～60,000/min
Die Sorter_APP-L10 Input Wafer : 8", 12" / Output : Tray 2”, 3”, 4” / Accuracy : Gap ±40㎛
Die Sorter_CDT-300 Input Wafer : 8", 12" / Output : 8", 12" / Accuracy : Gap ±50㎛, Rotation ≤ 1º
Die Sorter_DS9000 Input Wafer : 8", 12" / Output : 8"/ Accuracy : Gap ±50㎛, Rotation ≤ 1º
Remover_DAVID-R300 Wafer Size : 8" / Process : Coating Chemical Remove → D.I Water Cleaning
AVI_Eagle-i, Eagle-Ti Wafer Size : 6", 8", 12" / Pixel resolution : 3㎛, 1.7㎛, 1.1㎛, 0.85㎛
AVI_HT-1200 Tray Size : 2”, 3”, 4” / Pixel resolution : 3.3㎛
Inking_ESA-068) Ink Size : Small Dot : 200~500 ㎛, Large Dot : 500~1000 ㎛
Analysis Equipment
Analysis Equipment Specification
FE-SEM/EDS Resolution : 0.7 nm at 15kV, 1.0 nm at 1kV / Magnification : ×25 ~ ×1,500,000
3D Depth Profiler Resolution : 0.01 nm / Non-contact 3D Method / Maximun Magnification : x28800
Contact Angle Measurement Range : 0~180°
Warpage Measurement Camera : Standard 2.0 Mega Pixel (1628 x 1236), Digital, Black & White
Chip Strength Speed Accuracy : +/-0.1%, Max Speed at Full Load mm/min : 2500
Drop Test Payload Capacity : 85kg, Maximum Height : 150 cm
Vibration Test Motor Frequency : 10 ~ 60Hz / Amplitude Direction : Up & Down (0~3mm)
Ball Shear Test Bonded Wire Integrity Test, 6"/150mm, 8"/200mm